for Notebook JMT NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook

JMT NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook (for Notebook): Computers & Accessories. Buy JMT NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook (for Notebook): Heatsinks - ✓ FREE DELIVERY possible on eligible purchases. The front and back sides can simultaneously dissipate heat:Subverting traditional thermal conductivity: Carbonized alloys are hard and wear-resistant hexagonal crystals with good strength and higher thermal conductivity than conventional aluminum. The surface nano-layer increases the contact surface with the air, accelerates the exchange of heat, and has a high-grade appearance. . The high-purity nano thermal pad has a delicate and soft property, and when pressed, it will squeezing to the gap of each chip, bringing unexpected thermal conductivity. . Main heat sink thickness specification(For Desktop PC): 70 mm*23mm*7mm . Main heat sink thin specification(For Notebook): 70mm*23mm*2.5mm . Lower layer specification: 70mm*24mm*1mm . Specifications:. Material: composite silver-containing carbonized alloy. Surface: inner layer silver plating + outer layer oxide sandblasting. Main heat sink thickness specification(For Desktop PC): 70 mm*23mm*7mm. Main heat sink thin specification(For Notebook): 70mm*23mm*2.5mm. Lower layer specification: 70mm*24mm*1mm. Heat sink instantaneous peak thermal conductivity: 560W/mk. Interlayer thermal conductive material: nano-super soft non-fluid thermal Silica gel. Thermal pad instantaneous peak thermal conductivity: 8W/mk. . The front and back sides can simultaneously dissipate heat. Subverting traditional thermal conductivity: Carbonized alloys are hard and wear-resistant hexagonal crystals with good strength and higher thermal conductivity than conventional aluminum. The surface nano-layer increases the contact surface with the air, accelerates the exchange of heat, and has a high-grade appearance.. . Thermal conductivity comparison:. Silver plated + carbonized alloy: 560W/mk. Sterling silver: 429W/mk. Pure copper: 401W/mk. Pure aluminum: 237W/mk. . . The high-purity nano thermal pad has a delicate and soft property, and when pressed, it will squeezing to the gap of each chip, bringing unexpected thermal conductivity. Bonding strength: 0.3kg/inch. Thermal conductivity: 8W/mk. Adapt to temperature: -20 ° C ~ 120 ° C. . installation steps:. 1. Peel the protective film of M.2 thermal silica gel and stick it on the bottom of the heat sink.. 2. Insert the solid state drive into the heat sink slowly along the card slot.. 3. After tearing off the protective film of M.2 thermal silica gel, stick it on the hard disk, and insert the top heat sink into the card slot of the bottom heat sink along the card slot. . . .